{"schema_version": "vibe-public-case-engineering/v1", "case_id": "smart-ring", "requirements": [{"id": "requirement-001", "title": "台架方案", "kind": "architecture", "detail": "nRF52840开发平台+MAX86141评估前端+TMP117温度板；由仪器供电并输出带时间戳原始数据。", "status": "design_proposed", "status_label": "方案需求，待验证", "source_ids": []}, {"id": "requirement-002", "title": "产品方案", "kind": "architecture", "detail": "将BLE控制、电源、PPG模拟前端和温度热岛分区；环形FPC尺寸与电池到货图纸联动，先保留外置充电底座。", "status": "design_proposed", "status_label": "方案需求，待验证", "source_ids": []}, {"id": "requirement-003", "title": "电源域 AFE_1V8", "kind": "power_target", "detail": "标称电压目标：1.8 V。MAX86141逻辑域按准确数据手册接线；3.3V主机不得默认直连。", "status": "design_target", "status_label": "设计目标，非实测值", "source_ids": []}, {"id": "requirement-004", "title": "电源域 LED_3V3", "kind": "power_target", "detail": "标称电压目标：3.3 V。原厂范围3.1–5.5V；最低电压须包含压降，LED电流按器件和光学条件设置。", "status": "design_target", "status_label": "设计目标，非实测值", "source_ids": []}, {"id": "requirement-005", "title": "电源域 CTRL_3V3", "kind": "power_target", "detail": "标称电压目标：3.3 V。温度传感器远离稳压器；SPI电平转换应满足方向、时序和断电隔离。", "status": "design_target", "status_label": "设计目标，非实测值", "source_ids": []}, {"id": "requirement-006", "title": "接口 ppg-spi", "kind": "interface_target", "detail": "nRF SPI经电平转换 → MAX86141。以MAX86141确切I/O域验证电平转换；不得把I2C上拉型转换器直接用于高速SPI。", "status": "design_target", "status_label": "设计目标，非实测值", "source_ids": []}, {"id": "requirement-007", "title": "接口 temp-i2c", "kind": "interface_target", "detail": "nRF I2C → TMP117。100kHz初始配置，地址绑定位确定；上拉阻值由总电容与灌电流计算。", "status": "design_target", "status_label": "设计目标，非实测值", "source_ids": []}, {"id": "requirement-008", "title": "有效原始PPG采样率", "kind": "acceptance_target", "detail": "目标：>= 100 samples/s。方法：读取FIFO序号和采样配置，连续10分钟", "status": "design_target", "status_label": "设计目标，非实测值", "source_ids": []}, {"id": "requirement-009", "title": "30–40°C台架温度对照最大偏差", "kind": "acceptance_target", "detail": "目标：<= 0.3 degC。方法：控温块与校准参考探头稳态测量；此目标不是体温精度声明", "status": "design_target", "status_label": "设计目标，非实测值", "source_ids": []}, {"id": "requirement-010", "title": "断开后重新连接时间", "kind": "acceptance_target", "detail": "目标：<= 10 s。方法：固定手机/固件版本执行20次", "status": "design_target", "status_label": "设计目标，非实测值", "source_ids": []}, {"id": "requirement-011", "title": "无法解释的序列号缺口", "kind": "acceptance_target", "detail": "目标：== 0 count。方法：30分钟采集及短暂掉线恢复测试", "status": "design_target", "status_label": "设计目标，非实测值", "source_ids": []}], "components": [{"id": "board.adafruit-4090", "name": "USB Type C Breakout (4090)", "manufacturer": "Adafruit", "mpn": "USB Type C Breakout (4090)", "kind": "demo_board", "revision": "1", "relation": "selected_board_in_historical_audit", "status": "candidate", "status_label": "历史案例选板 · 待验证", "capabilities": [], "source_ids": ["source-efd12148d09630c4"], "missing_information": ["只提供接口和 CC 配置，不包含完整保险丝、ESD、过压或限流保护。", "历史案例选板不代表当前连接、固件、整机功能或实物测试通过。"]}, {"id": "board.adafruit-4410", "name": "Micro-Lipo USB-C (4410)", "manufacturer": "Adafruit", "mpn": "Micro-Lipo USB-C 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"mpn": "MAX17048 (5580)", "kind": "demo_board", "revision": "1", "relation": "selected_board_in_historical_audit", "status": "candidate", "status_label": "历史案例选板 · 待验证", "capabilities": ["battery_gauge"], "source_ids": ["source-3e36edad90b215e8", "source-949d4a2368a23193", "source-33160535aa653d3a", "source-127b874832894701", "source-ab7c6a9ae8c05e54", "source-2f89ed3ef8cf06bb"], "missing_information": ["电量计不包含充电或电池保护；需匹配电池模型。", "历史案例选板不代表当前连接、固件、整机功能或实物测试通过。"]}, {"id": "board.p-nucleo-wb55", "name": "P-NUCLEO-WB55", "manufacturer": "STMicroelectronics", "mpn": "P-NUCLEO-WB55", "kind": "demo_board", "revision": "1", "relation": "selected_board_in_historical_audit", "status": "candidate", "status_label": "历史案例选板 · 待验证", "capabilities": [], "source_ids": ["source-8b1ef0d9e4ef698e", "source-3b5f50e0337c52bf", "source-af91df851ddbfd23", "source-9927509910c7349c", "source-704c449c70d6426c", "source-6b805d3ecade4758", "source-98ff736456607751", "source-bb20a66e9d61ae11", "source-b7178ae50ce19b88", "source-61de1912bf72995a"], "missing_information": ["Nucleo/Discovery 是开发平台，不是已批准量产 PCBA；扩展板需核对板型、引脚及 STM32Cube 例程。", "历史案例选板不代表当前连接、固件、整机功能或实物测试通过。"]}, {"id": "board.x-nucleo-iks4a1", "name": "X-NUCLEO-IKS4A1", "manufacturer": "STMicroelectronics", "mpn": "X-NUCLEO-IKS4A1", "kind": "demo_board", "revision": "1", "relation": "selected_board_in_historical_audit", "status": "candidate", "status_label": "历史案例选板 · 待验证", "capabilities": ["惯性测量"], "source_ids": ["source-2f6f75915d8a3348", "source-4b83ad2f9ca76774", "source-0f5c48c310f91cde", "source-a1863c36429f5034", "source-4c864afa62edbf2b", "source-7aebb835dbb8f9bf"], "missing_information": ["官方 Demo 面向指定 Nucleo 与软件包；接到 ESP32 需重新核对电平、引脚、负载和驱动，不能据此宣称兼容。", "历史案例选板不代表当前连接、固件、整机功能或实物测试通过。"]}, {"id": "catalog.tlv75533pdbvr", "name": "TLV75533PDBVR", "manufacturer": "Texas Instruments", "mpn": "TLV75533PDBVR", "kind": "chip", "relation": "reference_component", "status": "candidate", "status_label": "精确型号候选，非已采用", "revision": null, "capabilities": [], "source_ids": ["source-e40a81d7c0636819"], "missing_information": []}, {"id": "mcu.nordic.nrf52840-qiaa-f-r", "name": "nRF52840-QIAA-F-R nRF52 wireless SoC", "manufacturer": "Nordic Semiconductor", "mpn": "nRF52840-QIAA-F-R", "kind": "chip", "relation": "reference_component", "status": "candidate", "status_label": "精确型号候选，非已采用", "revision": null, "capabilities": [], "source_ids": ["source-272900f63817058c", "source-281a219d2822c088", "source-a65c53e4fd4c591b", "source-752bd1305c83a25c"], "missing_information": ["封装焊盘几何、焊接工艺、PCB走线及热设计尚未完成核对", "具体应用的去耦、时钟、复位、启动和下载接口仍需设计及ERC检查", "未做芯片实测或量产验证；资料收录不等同工程放行", "采购生命周期、库存、批次和全部勘误须在选型冻结时复核", "RF匹配、天线、晶振、协议栈版本及射频认证未验证，需按原厂参考设计实施", "存储容量已核实原厂kB标称，但本轮原厂地址图下载HTTP403、未完成字节边界复核；flash_kib和sram_kib暂不强转，保留标称属性待补充。", "N24为build-code条件端子：Dxx及以前DEC5、Fxx及以后NC；订货功能后缀AA-F不替代实际build code，生产BOM冻结前必须核实。"]}, {"id": "power.adi.lt1763is8-pbf", "name": "LT1763IS8#PBF", "manufacturer": "Analog Devices", "mpn": "LT1763IS8#PBF", "kind": "chip", "relation": "reference_component", "status": "candidate", "status_label": "精确型号候选，非已采用", "revision": null, "capabilities": [], "source_ids": ["source-52aea5a1555ba4b2"], "missing_information": ["尚未建立并验证此精确封装的 PCB 焊盘库及装配工艺窗口", "尚未进行此器件在目标案例中的仿真、台架实测、EMC 或量产验证"]}, {"id": "power.microchip.mcp73832t-2aci-mc", "name": "MCP73832T-2ACI/MC", "manufacturer": "Microchip", "mpn": "MCP73832T-2ACI/MC", "kind": "chip", "relation": "reference_component", "status": "candidate", "status_label": "精确型号候选，非已采用", "revision": null, "capabilities": [], "source_ids": ["source-b2ecf475059ea860"], "missing_information": ["尚未建立并验证此精确封装的 PCB 焊盘库及装配工艺窗口", "尚未进行此器件在目标案例中的仿真、台架实测、EMC 或量产验证"]}, {"id": "power.ti.bq24075rgtr", "name": "BQ24075RGTR", "manufacturer": "Texas Instruments", "mpn": "BQ24075RGTR", "kind": "chip", "relation": "reference_component", "status": "candidate", "status_label": "精确型号候选，非已采用", "revision": null, "capabilities": [], "source_ids": ["source-b483f951483eae8a"], "missing_information": ["尚未建立并验证此精确封装的 PCB 焊盘库及装配工艺窗口", "尚未进行此器件在目标案例中的仿真、台架实测、EMC 或量产验证"]}, {"id": "power.ti.tps22918dbvr", "name": "TPS22918DBVR", "manufacturer": "Texas Instruments", "mpn": "TPS22918DBVR", "kind": "chip", "relation": "reference_component", "status": "candidate", "status_label": "精确型号候选，非已采用", "revision": null, "capabilities": [], "source_ids": ["source-02a138befb3e9d51"], "missing_information": ["尚未建立并验证此精确封装的 PCB 焊盘库及装配工艺窗口", "尚未进行此器件在目标案例中的仿真、台架实测、EMC 或量产验证"]}, {"id": "vendor-ic-fb49f93d020960", "name": "TPS6282X", "manufacturer": "见原厂器件资料", "mpn": null, "kind": "chip", "relation": "reference_component", "status": "candidate", "status_label": "型号或订货后缀待确认", "revision": "2026-09-22.1", "capabilities": [], "source_ids": ["source-e1a78f4fe7b3774e"], "missing_information": ["符号或系列名称不能当作已冻结的采购料号。"]}, {"id": "vendor.tmp117aiybgr", "name": "TMP117AIYBGR", "manufacturer": "Texas Instruments", "mpn": "TMP117AIYBGR", "kind": "chip", "relation": "reference_component", "status": "candidate", "status_label": "精确型号候选，非已采用", "revision": null, "capabilities": [], "source_ids": ["source-3c08d64c8067bf0e"], "missing_information": ["符号按原厂指定封装引脚表重建，并非原厂直接提供的EDA符号", "PCB焊盘文件、尺寸及方向尚未核对", "地址/使能/上拉/去耦与应用外围需按具体电路配置", "尚未完成瞬态、热、固件与实物验证"]}, {"id": "design-choice-1", "name": "MAX86141", "manufacturer": null, "mpn": null, "kind": "design_choice", "relation": "design_candidate", "status": "candidate", "status_label": "设计迭代候选，订货型号待冻结", "revision": "2026-09-23.1", "capabilities": [], "source_ids": ["source-f7007c52a5e81a0b"], "selection_reason": "外部LED/光电二极管便于调整反射光路；首版采集原始波形，不宣称临床指标。", "alternative_reason": "AFE4404作为替代；更换意味着接口、电源和固件一并修改。", "missing_information": ["准确订货号、封装与采购状态仍需确认；设计迭代候选不是已采用的量产物料。"]}, {"id": "design-choice-2", "name": "TMP117", "manufacturer": null, "mpn": null, "kind": "design_choice", "relation": "design_candidate", "status": "candidate", "status_label": "设计迭代候选，订货型号待冻结", "revision": "2026-09-23.1", "capabilities": [], "source_ids": ["source-ab196e52e8b754b0"], "selection_reason": "原厂高精度数字温度器件适合作为台架对照；系统精度仍由热耦合决定。", "alternative_reason": "", "missing_information": ["准确订货号、封装与采购状态仍需确认；设计迭代候选不是已采用的量产物料。"]}, {"id": "design-choice-3", "name": "nRF52840评估平台", "manufacturer": null, "mpn": null, "kind": "design_choice", "relation": "design_candidate", "status": "candidate", "status_label": "设计迭代候选，订货型号待冻结", "revision": "2026-09-23.1", "capabilities": [], "source_ids": ["source-0ecfb3c2b6d47727"], "selection_reason": "BLE与SPI台架开发基础成熟；最终封装与天线另锁定。", "alternative_reason": "", "missing_information": ["准确订货号、封装与采购状态仍需确认；设计迭代候选不是已采用的量产物料。"]}], "circuits": [{"id": "source:p-nucleo-wb55/0", "title": "P-NUCLEO-WB55 · 原厂资料重建电路", "kind": "reference_circuit", "relation": "source_schematic", "status": "source_schematic", "status_label": "板卡原厂参考电路", "revision": null, "component_ids": ["board.p-nucleo-wb55"], "source_ids": ["source-18d5845ce9963e5a"], "missing_information": ["原厂或资料重建电路只覆盖该板；整机电源、接口条件、板卡修订和样机结果仍需核对。"], "evidence_scope": 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"source_schematic", "status_label": "板卡原厂参考电路", "revision": null, "component_ids": ["board.x-nucleo-iks4a1"], "source_ids": ["source-4c864afa62edbf2b"], "missing_information": ["原厂或资料重建电路只覆盖该板；整机电源、接口条件、板卡修订和样机结果仍需核对。"], "evidence_scope": "historical_case_audit"}, {"id": "source:adafruit-4410/0", "title": "Micro-Lipo USB-C (4410) · 原厂器件电路", "kind": "reference_circuit", "relation": "source_schematic", "status": "source_schematic", "status_label": "板卡原厂参考电路", "revision": null, "component_ids": ["board.adafruit-4410"], "source_ids": ["source-1dfbc04eb0de9d4d", "source-94968607ac16c8da", "source-99ccc1378a1e4cbe", "source-e980a28cf12a24f4", "source-ec4167314ca031a0", "source-b62bfa6ad624c4fb"], "missing_information": ["原厂或资料重建电路只覆盖该板；整机电源、接口条件、板卡修订和样机结果仍需核对。"], "evidence_scope": "historical_case_audit"}, {"id": "source:adafruit-5580/0", "title": "MAX17048 (5580) · 原厂器件电路", "kind": "reference_circuit", "relation": "source_schematic", "status": "source_schematic", "status_label": "板卡原厂参考电路", 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